15th IEEE International Symposium and Exhibitionon Advanced Packaging Materials (APM2013)

The Institute of Electrical and Electronics Engineers - Components, Packaging and Manufacturing Technology Society (IEEE-CPMT) announces the 15th IEEE International Symposium and Exhibition on Advanced Packaging Materials to be held at Atrium Hotel in Irvine, California from February 27th to March 1st, 2013.

Abstracts are solicited in the following areas:

• Adhesives and underfills- materials & applications, advanced processes, and reliability
• Circuit boards, substrates, and dielectrics- advanced circuit boards and substrates, properties, and processing
• Encapsulants, thin films, and coatings- materials & applications, new processes, and reliability
• Flip-chip interconnect materials and processing- bumping materials, bumping methods, and reliability evaluations
• Materials and processes for 3-D integration- thru-silicon-via formation, stacking, plating and bonding
• Optoelectronic and microwave materials- New materials and processes for optoelectronic and microwave packaging
• Solders and soldering operations - lead-free solders, new bonding and soldering processes, reliability

For more information, please contact:

General Chair: Tom Gregorich Broadcom Coporation

Program Chair: Prof. Chin C. Lee University of California, Irvine

Publicity Chair: Sam Karikalan Broadcom Coporation